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ULLC0402FC3.3C مماثلة

  • ULLC0402FC05C
    • 5.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
  • ULLC0402FC08C
    • 8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
  • ULLC0402FC12C
    • 12.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
  • ULLC0402FC15C
    • 15.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
  • ULLC0402FC24C
    • 24.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
  • ULLC0402FC3.3C
    • 3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards

ULLC0402FC3.3C Datasheet والمضاربه

الصانع : Protek Devices 

التعبءه :  

دبابيس : 0 

درجة الحراره : دقيقة -55 °C | الاقصى 150 °C

حجم : 174 KB

التطبيق : 3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards 

ULLC0402FC3.3C تحميل PDF