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Hytek الموقع الرسمي

آخر Hytek datasheet PDF

جزء لاالتطبيق
HY5640 Subminiature controller for thermoelectric cooler
HY6330 Laser diode driver
HY6510 400 mA High speed laser diode driver
HY5600 Subminiature controller for thermoelectric cooler
HY5600B TEC controller evaluation board
HY6340 Laser diode driver
HY5630B TEC controller
HY5650 Subminiature controller for thermoelectric cooler
HY6210 200mA High speed laser diode driver
HY5620 Subminiature controller for thermoelectric cooler
HY5670 TEC controller evaluation board
HY5640B TEC controller
HY7110 Micro-heater
HY5610 Subminiature controller for thermoelectric cooler
HY6110 200mA High speed laser diode driver
HY6410 400 mA High speed laser diode driver
HY5630 Subminiature controller for thermoelectric cooler
HY5610B TEC controller evaluation board

لمحة Hytek

DC Heaters Hytek offers proportionally controlled DC heaters with integral thermistor and temperature control circuits. TEC Controllers Hytek designs and manufactures miniature multi-chip electronic controllers for use with thermoelectric coolers to control the temperature of critical components such as photodetectors, laser diodes, and microwave transistors. Two types of controllers are available, cool-only and heat/cool ("bipolar"). These components are manufactured to high-reliability criteria and are used in fiber optic transmission systems as well as space/satellite applications. Laser Diode Drivers Hytek also designs and manufactures miniature electronic modules to drive laser diodes, both pulsed and constant current. Two package styles are available, SMA connectorized and through-hole. Hytek can modify the electrical and mechanical design of these products to a customers custom specification. Digital Delay Lines Hytek digital delay lines are thick film multi-chip circuits specifically designed and constructed for high reliability military and space applications. Hytek provides many of the standard military delay lines under DSCC's MIL-D-83532 Qualified Products Program. These products are manufactured under the MIL-PRF-38534 Hybrid Microelectronics qualified manufacturing program and tested in accordance with MIL-STD-883. The metal DIP packages are hermetically sealed in an inert gas atmosphere.

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